Nippon Kinzoku Develops FI Insulated Stainless Steel To Revolutionise Compact Electronics
KUALA LUMPUR, April 16 (Bernama) -- Nippon Kinzoku Co Ltd, headquartered in Tokyo, announced it has developed the "Fine Insulation (FI) finish", a stainless steel with high surface insulation resistance.
This development addresses growing demands in the electronics industry for more compact and low-profile devices such as smartphones and game consoles, according to a statement.
Traditionally, preventing short circuits in electronics has required the application of insulating tape or resin materials. These methods have hindered both miniaturisation and cost-efficiency.
In contrast, Nippon Kinzoku's FI finish eliminates the need for such post-processing, reducing both space requirements and production costs while enhancing productivity.
The company plans to target applications in consumer electronics and secondary batteries, emphasising the FI finish's value as an “Eco-Product”.
It meets Nippon Kinzoku’s environmental standards by minimising the need for insulation treatment at the production site, thereby lowering environmental impact. This innovation also aligns with the company’s broader goal of achieving net-zero carbon dioxide emissions by 2050.
Key features of the FI finish include high surface insulation resistance (over 50 milliohm), heat tolerance up to 850 degrees Celcius, scratch resistance, and a coating thickness of just 0.5 to one micrometre.
With customisable specifications in thickness of 0.05 to 0.15 millimetre (mm) and width up to 500mm, Nippon Kinzoku leverages its proprietary cold-rolling technology and expertise to meet a wide range of client needs across the steel strip product market.
-- BERNAMA