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KUALA LUMPUR, May 19 (Bernama) -- Five manufacturing subsectors were identified as being most affected by the impact of the energy crisis and global supply disruptions, according to Economy Minister Akmal Nasrullah Ahmad Nasir.
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GEORGE TOWN, May 18 (Bernama) -- Malaysia’s economic growth prospects remain positive, supported by inflows of foreign and domestic investments and sustained demand in the artificial intelligence (AI), data centre, and semiconductor sectors.
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KUALA LUMPUR, May 18 (Bernama) -- Malaysia is well-positioned to benefit from the ongoing global supply chain restructuring as multinational corporations continue diversifying operations beyond China and Taiwan amid persistent geopolitical tensions, according to Apex Securities Bhd.
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KUALA LUMPUR, May 15 (Bernama) -- Bank Negara Malaysia (BNM) has already priced in potential scenarios from the ongoing West Asia conflict into its 2026 growth and inflation forecasts, Governor Datuk Seri Abdul Rasheed Ghaffour said today.
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By Durratul Ain Ahmad Fuad
KUALA LUMPUR, May 12 (Bernama) -- Taiwan is seeking to strengthen cooperation with Malaysia in the high-tech supply chain, particularly in the electrical and electronics (E&E) sector, including semiconductors and artificial intelligence (AI).
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HAIKOU (China), May 12 (Bernama) -- The Regional Comprehensive Economic Partnership (RCEP) must evolve beyond traditional tariff reductions and simple transhipment towards high-complexity trade and integrated supply chains.
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KUALA LUMPUR, May 12 (Bernama) -- Bursa Malaysia opened higher on Tuesday, mirroring Wall Street’s positive overnight performance amid expectations of spillover buying interest into the FTSE Bursa Malaysia KLCI (FBM KLCI).
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PUTRAJAYA, May 11 (Bernama) -- The government has extended offers under the strategic collaboration between the Malaysian government and Arm Ltd to three local companies as part of efforts to strengthen the nation’s capabilities in integrated circuit (IC) design.
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BATU KAWAN, May 8 (Bernama) -- The Economy Ministry is focusing on efforts to strengthen the nation’s economic resilience and safeguard the supply of key input materials amidst the ongoing global uncertainty and crises.
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BATU KAWAN, May 8 (Bernama) -- Malaysia aims to develop domestic capability in advanced semiconductor packaging within two years through the establishment of the Malaysia Advanced Packaging Consortium (MAPC).
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KUALA LUMPUR, May 8 (Bernama) -- Malaysia is positioning itself to move beyond its long-standing leadership in assembly, testing and packaging towards leadership in advanced packaging as artificial intelligence (AI) reshapes the global semiconductor industry.
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KUALA LUMPUR, May 7 (Bernama) -- Malaysia must continue attracting strategic, high-quality investments while ensuring that local companies capture greater share of the value created by global investors operating in the country, said Malaysian Investment Development Authority (MIDA) chief executive officer Datuk Sikh Shamsul Ibrahim Sikh Abdul Majid.