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KUALA LUMPUR, Oct 18 (Bernama) -- Wood Mackenzie in its latest Horizons report revealed that the United States (US) power demand is set to soar for the first time in decades, with growth between four per cent and 15 per cent through 2029, depending on the region.
KUALA LUMPUR, Oct 1 (Bernama) -- United Microelectronics Corporation (UMC), a global semiconductor foundry, has signed a memorandum of understanding (MoU) with Ngee Ann Polytechnic (NP) to enhance training for engineering talents and expand the workforce for the growing semiconductor industry.
KUALA LUMPUR, Sept 19 (Bernama) -- Teledyne DALSA, a Teledyne Technologies company, has introduced the Linea HS2 TDI line scan camera family, representing a significant breakthrough in next generation time delay and integration (TDI) technology.
