1y ago
By Nurunnasihah Ahmad Rashid
KUALA LUMPUR, March 5 (Bernama) — Negotiations between Malaysia and Arm Holdings Plc, which have been finalised, represent an important step in strengthening the country's semiconductor ecosystem and accelerating the development of local technology, said Investment, Trade, and Industry Minister Tengku Datuk Seri Zafrul Abdul Aziz.
1y ago
By Nurunnasihah Ahmad Rashid
KUALA LUMPUR, Feb 7 (Bernama) – The Malaysian government takes seriously the allegation that the country is being used as a transit point for smuggling Nvidia artificial intelligence (AI) chips to China and is committed to complying with multilateral international export control regulations.
1y ago
KUALA LUMPUR, Jan 15 (Bernama) -- A local vendor development programme jointly curated by the Malaysian Investment Development Authority (MIDA) and Infineon Technologies (Kulim) Sdn Bhd will benefit 139 local companies.
1y ago
KUALA LUMPUR, Dec 17 (Bernama) -- Malaysia’s electric vehicle (EV) industry is accelerating, with over 100,000 electrified vehicles recorded and more than 3,300 charging stations established nationwide to date, positioning the country as a key regional hub for EV innovation.
1y ago
GEORGE TOWN, Dec 5 (Bernama) -- There will not be any major changes in the economic relations between the United States (US) and Malaysia under the new leadership, said US Ambassador to Malaysia Edgard D Kagan.
1y ago
KUALA LUMPUR, Oct 21 (Bernama) -- The Investment, Trade and Industry Ministry (MITI) is confident of achieving the first-year targets of the New Industrial Master Plan 2030 (NIMP 2030), having already fulfilled three of the main indicators set, according to its minister Tengku Datuk Seri Zafrul Abdul Aziz.
1y ago
KUALA LUMPUR, Oct 18 (Bernama) -- Wood Mackenzie in its latest Horizons report revealed that the United States (US) power demand is set to soar for the first time in decades, with growth between four per cent and 15 per cent through 2029, depending on the region.
1y ago
KUALA LUMPUR, Oct 1 (Bernama) -- United Microelectronics Corporation (UMC), a global semiconductor foundry, has signed a memorandum of understanding (MoU) with Ngee Ann Polytechnic (NP) to enhance training for engineering talents and expand the workforce for the growing semiconductor industry.
1y ago
KUALA LUMPUR, Sept 19 (Bernama) -- Teledyne DALSA, a Teledyne Technologies company, has introduced the Linea HS2 TDI line scan camera family, representing a significant breakthrough in next generation time delay and integration (TDI) technology.