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Asuransi Tokio Marine Indonesia’s Credit Ratings Affirmed By AM Best

KUALA LUMPUR, May 16 (Bernama) -- Global credit rating agency, AM Best has affirmed the financial strength rating of A- (Excellent) and the long-term issuer credit rating of “a-” (Excellent) of PT Asuransi Tokio Marine Indonesia (TMI).

Proton Trades Old Vehicles For New Under RM4.8 Mln Xchange Programme

KUALA LUMPUR, May 15 (Bernama) -- Owners of old vehicles are encouraged to exchange them for new Proton models under a RM4.8 million “Proton Xchange Programme” the national car maker launched today in partnership with Car Medic Sdn Bhd.

Malaysia, Japan Ink RM1.34 Bln Green Bioeconomy Deals At Expo 2025 Osaka

KUALA LUMPUR, May 15 (Bernama) -- Malaysia and Japan reached a new milestone in their green bioeconomy partnership with the signing of three strategic agreements worth RM1.34 billion on May 12 at Expo 2025 Osaka in Japan.

Gold Likely To Keep Rallying Until Next Year Amid Global Uncertainties -- UBS

KUALA LUMPUR, May 15 (Bernama) -- UBS Investment Bank remains bullish on gold and expects the precious metal to continue to rally, likely until the second or third quarter of next year, amid global uncertainties. 

HLIB Optimistic On Malaysia's RE Sector, Retains 'Overweight' Call

KUALA LUMPUR, May 15 (Bernama) -- Hong Leong Investment Bank Bhd (HLIB) is optimistic about Malaysia’s renewable energy (RE) sector due to its strong structural themes and positive earnings growth cycle, maintaining its ‘overweight’ call on the industry.

MCE Signs MoUs To Support Localisation Of Chery Malaysia's Production

KUALA LUMPUR, May 14 (Bernama) -- MCE Holdings Bhd, through wholly owned unit Multi-Code Electronics Industries Bhd, has signed memoranda of understanding (MOUs) with two Wuhu, China-based companies -- Cheling Smart Mobility Technology (Wuhu) Co, Ltd (CSM) and Wuhu Atech Automotive Electronics Co Ltd -- to support the localisation of Chery Malaysia’s production.

CelcomDigi, MoF Inc, YTL, Maxis & DNB Sign Revised Agreement On DNB Shareholding Structure

KUALA LUMPUR, May 13 (Bernama) -- A significant restructuring in the shareholding of Digital Nasional Bhd (DNB) has been confirmed through a newly signed Letter of Variation dated today, altering key terms in the previously agreed shareholders agreement on June 28, 2024. 

OM Holdings Sells 26 Pct Interest In NMPL For US$101.4 Mln

KUALA LUMPUR, May 13 (Bernama) -- OM Holdings Ltd’s (OMH) wholly owned subsidiary OMH (Mauritius) Corp (OM Mauritius) has entered into a conditional binding agreement with Exxaro Resources Ltd to sell its entire 26 per cent interest in Ntsimbintle Mining Proprietary Ltd (NMPL) for about US$101.4 million (US$1=RM4.32).

reNIKOLA Inks MoU With Sumitomo To Develop Bioenergy Projects In Malaysia, Indonesia

KUALA LUMPUR, May 13 (Bernama) -- Renewable energy company reNIKOLA Holdings Sdn Bhd has signed a memorandum of understanding (MoU) with Japanese trading house Sumitomo Corporation to jointly develop large-scale bioenergy projects in Malaysia and Indonesia.

HLIB Maintains 'Neutral' Call On Malaysian Plantation Sector Amid Mixed Outlook

KUALA LUMPUR, May 13 (Bernama) -- Hong Leong Investment Bank Bhd (HLIB) has maintained its 'neutral' call on the plantation sector, citing a lack of clear demand catalysts and mixed earnings prospects across both upstream and downstream segments.

2025 Container Growth Forecast At 2.5 Pct, 'Hold' Rating On Westports - CIMB Securities

KUALA LUMPUR, May 13 (Bernama) -- CIMB Securities Sdn Bhd has maintained a 2025 growth forecast of 2.5 per cent for container throughput, underpinned by new services from shipping alliances, and potential front-loading activities during the 90-day tariff pause.

Malaysia To Boost Semiconductor Expertise As US Rescinds Chip Export Curbs

KUALA LUMPUR, May 12 (Bernama) -- Malaysia can have greater access to more advanced semiconductor chips following Washington’s move to rescind curbs on chip exports, a move that can propel it to move beyond its current strength in midstream packaging and testing into higher-value upstream chip design.