ASEAN Ready To Upgrade FTA With Japan

OSAKA (Japan), Aug 9 (Bernama) -- ASEAN has expressed its readiness to upgrade its free trade agreement (FTA) with Japan, signalling a desire to bring the decades-old pact into the modern economic era.

Reform Must Become Part Of The ASEAN Way To Withstand Global Shocks - Tengku Zafrul

By Rosemarie Khoo Mohd Sani

KUALA LUMPUR, Aug 7 (Bernama) -- The Investment, Trade and Industry Minister Tengku Datuk Seri Zafrul Abdul Aziz has called for structural reforms to continue nationally and on the ASEAN level, noting that the region must remain strong in the face of rising geopolitical and economic uncertainties.

Malaysia's Successful Tariff Negotiation Seen As Strategic Step Forward -- Economists

By Siti Radziah Hamzah

KUALA LUMPUR, Aug 3 (Bernama) -- Malaysia’s successful negotiation to reduce the reciprocal tariff imposed by the United States (US) on its exports to 19 per cent from 25 per cent is seen as a strategic step forward, placing the country on equal footing with major ASEAN peers while preserving key domestic policy priorities.

ASEAN's Position As Regional Economic Powerhouse Remains Intact -- BNM Governor

KUALA LUMPUR, July 30 (Bernama) -- ASEAN’s position as an emerging regional economic powerhouse remains intact, as does its commitment to deepen economic integration, such as in the area of finance, said Bank Negara Malaysia (BNM) Governor Datuk Seri Abdul Rasheed Ghaffour.

ASEAN Must Speed Up Its Integration Amid Global Trade Headwinds -- Tengku Zafrul

KUALA LUMPUR, July 24 (Bernama) -- ASEAN must step forward together and speed up its integration to reduce trade friction among its members amid global trade uncertainties, said Minister of Investment, Trade and Industry Tengku Datuk Seri Zafrul Abdul Aziz.

Malaysia Urges ASEAN Unity To Build Integrated Semiconductor Supply Chain

KUALA LUMPUR, July 24 (Bernama) -- Malaysia is ready to collaborate with ASEAN partners and beyond through joint investments, research partnerships and knowledge sharing to turn regional ambitions into reality, said Investment, Trade and Industry Ministry Deputy Minister Liew Chin Tong.

MTD Properties Targets To Invest RM4 Bln For Melaka Project

MELAKA, July 24 (Bernama) -- Property developer MTD Properties Sdn Bhd is planning to undertake a strategic development project in Ayer Keroh, with an estimated investment value of around RM4 billion.

US Tariffs Dominate ASEAN Talks As Leaders Rally Around Trade Unity

KUALA LUMPUR, July 12 (Bernama) -- As global trade tensions continue to rise, the 58th ASEAN Foreign Ministers’ Meeting (AMM) and Related Meetings wrapped up its four days of talks in Kuala Lumpur on Friday, July 11, with the United States’ (US) sweeping tariff hikes becoming a major talking point among regional leaders.

ASEAN-Based MNCs Could Be Key To Navigating Economic Challenges — Liew

KUALA LUMPUR, July 11 (Bernama) -- The emergence of more ASEAN-based multinational corporations (MNCs) with strong ties to United States (US) companies could be key to navigating current economic challenges and shaping a new regional growth framework.

US Reciprocal Tariffs Open Door To Stronger Intra-ASEAN Trade -- Lazaro

By Zufazlin Baharuddin

KUALA LUMPUR, July 9 (Bernama) -- The imposition of the new reciprocal United States tariff could present a greater opportunity to strengthen intra-ASEAN trade, said Philippines Foreign Affairs Secretary Ma. Theresa P. Lazaro.

Anwar’s Visits To Italy, France, Brazil To Strengthen Investment, Trade Prospects

By Rosemarie Khoo Mohd Sani and Mikhail Raj Abdullah 

KUALA LUMPUR, July 8 (Bernama) -- Malaysia stands to gain immensely from Prime Minister Datuk Seri Anwar Ibrahim’s official visits to Italy, France and Brazil, not only in attracting potential investments, but also in expanding export markets as protectionist tendencies from American tariffs threaten to shutter global trade.

CT Group Unveils Vietnamese-Designed IoT Chip In Strategic Semiconductor Push

KUALA LUMPUR, June 30 (Bernama) -- Vietnam-based CT Group has launched its first locally designed Internet of Things (IoT) chip, marking a significant milestone in its 33rd anniversary celebration and the conclusion of its initial three-year plan within its second 30-year development phase.