1d ago
KUALA LUMPUR, May 11 (Bernama) -- Malaysia wants original equipment manufacturers (OEMs) to collaborate with local vendors to level up the entire value chain and ecosystem via the new electric vehicle (EV) policy, said Deputy Investment, Trade and Industry Minister Sim Tze Tzin.
2m ago
KUALA LUMPUR, Feb 25 (Bernama) -- The Kuala Lumpur rubber market ended higher on Wednesday, supported by gains in regional rubber futures and tightening global supply due to weather disruptions during the wintering season, a trader said.
2m ago
KUALA LUMPUR, Feb 25 (Bernama) -- Toshiba Electronic Devices & Storage Corporation (Toshiba) has launched four voltage-driven photorelays, “TLP3407SRB”, “TLP3412SRB“, ”TLP3412SRHB“, and “TLP3412SRLB”, housed in the small S-VSON4T package.
9m ago
KUALA LUMPUR, July 29 (Bernama) -- Oxford Innotech Bhd made a strong debut on Bursa Malaysia’s ACE Market today, opening at 36 sen, a seven sen or 24 per cent premium over its initial public offering (IPO) price of 29 sen.
11m ago
KUALA LUMPUR, May 19 (Bernama) -- MCE Holdings Bhd has signed a joint venture (JV) with Nanjing Chuhang Technology Co Ltd (NCT) to produce driver assistance radar.
1y ago
KUALA LUMPUR, Dec 27 (Bernama) -- Wisson Robotics, a leader in general-purpose soft robotics, will debut its Pliabot technology, a revolutionary commercial and universal soft robotics with human-like muscles and embodied artificial intelligence (AI), at the Consumer Electronics Show (CES) 2025.
1y ago
KUALA LUMPUR, Dec 18 (Bernama) -- SiMa.ai has collaborated with Synopsys to jointly deliver a new solution for automotive companies to accelerate the development of workload-specific silicon and software needed to power artificial intelligence (AI)-enabled features in next-generation automobiles.
1y ago
KUALA LUMPUR, Dec 4 (Bernama) -- Kioxia Corporation, a world leader in memory solutions, has received Automotive Software Process Improvement and Capability dEtermination (ASPICE) Capability Level 2 (CL2) certification for its Universal Flash Storage (UFS) Ver. 4.0 embedded flash memory devices designed for automotive applications.
1y ago
KUALA LUMPUR, Nov 1 (Bernama) -- XPENG, a Chinese high-technology car company, has secured places on both the "Fortune Tech 50" and "Fortune China 500" lists, reaffirming its competitive advantage and status as a leader in technological innovation.