LATEST NEWS   Malaysia Cup: Selangor FC 1-1 Kuching City FC | Malaysia needs to adopt a smart diplomatic approach to deal with global economic uncertainties due to world geopolitical conflicts - PM Anwar | Perak MADANI Rakyat programme 2026 records 303,222 visitors, highest since its inception - Nga | Younger generation needs to master skills, expertise in new fields to create more local experts - PM Anwar | 

There are 29 news based on search keyword " advanced packaging"

Malaysia Invites Japanese Investors To Move Up Semiconductor Value Chain -- Sim

KUALA LUMPUR, March 31 (Bernama) -- Malaysia has called on Japanese investors to deepen its integration into the country’s semiconductor ecosystem and move beyond assembly into higher-value segments such as integrated circuit design, advanced packaging, research and development,  green sectors and local talent.

Intel's Packaging Complex, Assembly Manufacturing Operational This Year - PM Anwar

KUALA LUMPUR, March 17 (Bernama) -- Intel’s investment in Malaysia is set to expand, with its advanced packaging complex and assembly manufacturing expected to be operational later this year, said Prime Minister Datuk Seri Anwar Ibrahim.

OXMIQ Partners AM Intelligence Labs On India AI Compute Hub

KUALA LUMPUR, March 16 (Bernama) -- OXMIQ Labs (OXMIQ), a GPU architecture and artificial intelligence (AI) technology company, has announced a strategic technology partnership with AM Intelligence Labs to provide data centre and system infrastructure advisory.

Photonics Sector Could Expand Malaysia’s OSAT Market To US$4.6 Bln By 2030

KUALA LUMPUR, March 10 (Bernama) -- Malaysia’s outsourced semiconductor assembly and test (OSAT) industry could see new opportunities from the growing photonics sector, with the market projected to expand to about US$4.6 billion by 2030 as demand for optical networking infrastructure rises.

MOSTI Focuses On Integrated Circuit Design, High Value Technology To Improve Country's Economy

KUALA LUMPUR, March 4 (Bernama) -- The Ministry of Science, Technology and Innovation (MOSTI) through MIMOS Bhd is focusing on integrated circuit (IC) design, advanced packaging and high-value technology to increase the complexity of the country's economy.

NIMP 2030 A Catalyst For Malaysia's Shift Towards High-value Manufacturing -- Industry Players

KUALA LUMPUR, Feb 12 (Bernama) -- The New Industrial Master Plan 2030 (NIMP 2030) is emerging as a key driver of Malaysia’s transition from volume-based manufacturing to a more innovation-led, high-value economy, according to industry players.

Malaysia’s Export Outlook Points To Moderate Growth Amid Global Trade Shifts

PETALING JAYA, Jan 12 (Bernama) -- Malaysia’s export outlook is characterised by moderate growth this year as the global economy adjusts to shifting trade patterns and new tariff structures. 

InvestPenang, Intel To Continue Working Closely To Support Penang’s Transition Into Next-Generation Technologies

GEORGE TOWN, Dec 3 (Bernama) -- InvestPenang and Intel Corporation will continue working closely together to strengthen Penang as the state transitions into the critical areas of advanced packaging and next-generation technologies.

Intel Announces Additional RM860 Mln Investment To Make Malaysia Its Assembly Operations Hub

KUALA LUMPUR, Dec 1 (Bernama) -- Intel Corporation has announced an additional investment worth RM860 million to make Malaysia its assembly and test operations hub, said Prime Minister Datuk Seri Anwar Ibrahim.

Government Attracts Over RM70.7 Bln In Investments Through NSS As Of June 2025 — Lim

GEORGE TOWN, Nov 26 (Bernama) -- The government has successfully attracted more than RM70.7 billion in investments under the National Semiconductor Strategy (NSS) since its launch last year until June 2025.

Malaysia Aims To Move Up E&E Value Chain -- Amir Hamzah

KUALA LUMPUR, Nov 17 (Bernama) -- Malaysia’s next strategy for the electrical and electronic (E&E) and semiconductor industry is to scale up its value chain amid global trade challenges, said Finance Minister II Datuk Seri Amir Hamzah Azizan

Over 13,000 Engineers, Skilled Technical Personnel Trained, Absorbed Into Chip Industry Since NSS Launch

KUALA LUMPUR, Nov 17 (Bernama) -- A total of 13,679 engineers and skilled technical personnel have been trained, certified and absorbed into various segments of the semiconductor industry since the National Semiconductor Strategy (NSS) was launched in May 2024.