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KUALA LUMPUR, May 20 (Bernama) -- Arteris Inc announced its semiconductor system intellectual property (IP) technology has been deployed by Li Auto Inc to support artificial intelligence (AI) compute data movement and systems-on-chip (SoCs) integration for the automaker’s next-generation smart vehicle platforms, beginning with the new L9 Livis SUV.
KUALA LUMPUR, May 14 (Bernama) -- Toshiba Electronic Devices & Storage Corporation (Toshiba) has started shipping engineering samples of "TB9M040FTG", a motor control device with built-in power MOSFETs for three-phase brushless DC motor drives.
KUALA LUMPUR, April 28 (Bernama) -- Amazon has signed an agreement with Meta to deploy Amazon Web Services (AWS) Graviton processors at scale, marking a significant expansion of their long-standing partnership as Meta builds its next generation of artificial intelligence (AI).
KUALA LUMPUR, April 16 (Bernama) -- Toshiba Electronic Devices & Storage Corporation (Toshiba) has started shipping engineering samples of its latest SmartMCD motor control device, the “TB9M030FG”, designed for automotive applications.
KUALA LUMPUR, Dec 3 (Bernama) -- Teledyne DALSA, a Teledyne Technologies company, announced the launch of the Xtium3 PCIe Gen4 family, its next-generation frame grabber engineered to deliver maximum sustained throughput and ready-to-use image data for high-performance industrial applications.
KUALA LUMPUR, July 9 (Bernama) -- SiPearl, the European startup developing energy-efficient processors for supercomputing and artificial intelligence (AI), has completed the final 32 million euros tranche of its 130 million euros Series A funding round. (1 euro = RM4.96)
KUALA LUMPUR, Feb 25 (Bernama) -- KAYTUS, an end-to-end artificial intelligence (AI) and liquid cooling solutions provider, has announced its dual-socket V3 series server, KR1280V3, has secured top rankings in the latest SPEC CPU 2017 benchmark results published by the internationally recognised Standard Performance Evaluation Corporation (SPEC).
