Malaysia Aims To Build Advanced Semiconductor Packaging In Two Years

BATU KAWAN, May 8 (Bernama) -- Malaysia aims to develop domestic capability in advanced semiconductor packaging within two years through the establishment of the Malaysia Advanced Packaging Consortium (MAPC).

Photonics Sector Could Expand Malaysia’s OSAT Market To US$4.6 Bln By 2030

KUALA LUMPUR, March 10 (Bernama) -- Malaysia’s outsourced semiconductor assembly and test (OSAT) industry could see new opportunities from the growing photonics sector, with the market projected to expand to about US$4.6 billion by 2030 as demand for optical networking infrastructure rises.

Brazil At Sweet Spot For Malaysian Semiconductor Industry To De-risk Supply Chain - Tengku Zafrul

From M. Saraswathi

RIO DE JANEIRO (Brazil), Nov 19 (Bernama) -- The largest South American country Brazil is strategically located for Malaysian semiconductor industry’s “Plus One” strategy to de-risk their supply chain resiliency.

CT Semiconductor Launches ATP Chip Semiconductor Chip Technician Training Center In Vietnam

KUALA LUMPUR, Oct 3 (Bernama) -- CT Semiconductor, a member of CT Group, has officially inaugurated and commenced operations of its ATP Semiconductor Chip Technician Training Center at the National Innovation Center (NIC) in Hoa Lac High-Tech Park, Hanoi, Vietnam, on Oct 1.