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KUALA LUMPUR, May 14 (Bernama) -- The government is looking at ways to incentivise transport operators to adopt electric vehicle (EV) trucks as part of long-term efforts to reduce the country’s diesel subsidy burden.
KUALA LUMPUR, May 13 (Bernama) -- The International Construction Week (ICW) Borneo 2026 was officially launched in Kota Kinabalu yesterday, marking the second edition of the regional construction industry event focusing on industry development, technical discussions and engagement with stakeholders in East Malaysia.
By Durratul Ain Ahmad Fuad
KUALA LUMPUR, May 12 (Bernama) -- Taiwan is seeking to strengthen cooperation with Malaysia in the high-tech supply chain, particularly in the electrical and electronics (E&E) sector, including semiconductors and artificial intelligence (AI).
KUALA LUMPUR, May 12 (Bernama) -- Persona AI announced a research and development collaboration with Under Armour to study how advanced performance materials can support humanoid robots operating in industrial environments.
KUALA LUMPUR, May 12 (Bernama) -- Mavenir, a cloud-native software company, has been selected by MagtiCom, Georgia’s largest telecommunications provider, as the strategic small cell technology partner for a nationwide deployment project.
KUALA LUMPUR, May 12 (Bernama) -- Bursa Malaysia opened higher on Tuesday, mirroring Wall Street’s positive overnight performance amid expectations of spillover buying interest into the FTSE Bursa Malaysia KLCI (FBM KLCI).
PUTRAJAYA, May 11 (Bernama) -- The government has extended offers under the strategic collaboration between the Malaysian government and Arm Ltd to three local companies as part of efforts to strengthen the nation’s capabilities in integrated circuit (IC) design.
BATU KAWAN, May 8 (Bernama) -- Malaysia aims to develop domestic capability in advanced semiconductor packaging within two years through the establishment of the Malaysia Advanced Packaging Consortium (MAPC).
KUALA LUMPUR, May 8 (Bernama) -- Malaysia is positioning itself to move beyond its long-standing leadership in assembly, testing and packaging towards leadership in advanced packaging as artificial intelligence (AI) reshapes the global semiconductor industry.
KUALA LUMPUR, May 7 (Bernama) -- The Malaysian Investment Development Authority (MIDA) is strengthening Malaysia’s semiconductor ecosystem through a strategic focus on talent development, smart manufacturing and supply chain integration in conjunction with SEMICON Southeast Asia 2026.
KUALA LUMPUR, May 6 (Bernama) -- Digital payments company Visa has launched the Visa Agentic Ready programme to support the payments ecosystem in the era of agentic commerce.
By Abdul Hamid A Rahman
KUALA LUMPUR, May 6 (Bernama) -- Taiwan is looking to strengthen collaboration with Malaysia in the semiconductor and smart manufacturing sectors, particularly in data centres and robotics, by leveraging the complementary strengths of both economies across the semiconductor value chain.
