Boyd Unveils Plug-And-Play Tool To Speed Up Liquid-Cooled Data Centre Deployment
KUALA LUMPUR, Aug 28 (Bernama) -- Boyd has introduced a new thermal testing tool, the Rack Emulator, aimed at enabling safer and more efficient deployment of liquid-cooled data centres, particularly for artificial intelligence (AI) infrastructure.
In a statement, the company said the Rack Emulator is designed to simulate the pressure drop and heat dissipation of a rack while using automation to test coolant distribution units (CDUs) and facility cooling systems.
The tool validates thermal performance before connection to data centre information technology (IT) equipment, ensuring efficient and safe operation during start-up without risk of damage.
“Boyd’s new Rack Emulator will help our end clients reliably and safely validate thermal performance and safeguard their IT equipment,” said Boyd President, Thermal Solutions Division, David Huang.
Boyd’s Rack Emulator is programmable and flexible, capable of simulating any rack by connecting to the liquid cooling system and inputting capacity and pressure drop protocols.
Additionally, the emulator can test electrical inputs to the rack before the server is installed, further enhancing safety and reliability.
Functioning as a thermal load bank and simulator in a rack-sized package, the Rack Emulator fits conveniently within a data centre row, minimising space requirements and simplifying load bank testing. The tool is easy to ship, store, and operate, helping lower the total cost of ownership.
Available for order now, Boyd confirmed that shipments of the Rack Emulator will commence in September.
Boyd’s liquid cooling technologies, supported by a global service model, enable clients to meet thermal performance specifications through modular and easy-to-adopt designs, backed by decades of design and manufacturing expertise.
-- BERNAMA