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KUALA LUMPUR, June 16 (Bernama) -- K-Startup Grand Challenge 2026 (KSGC 2026) is making a final call as applications close on June 17, offering global startups the opportunity to join South Korea’s flagship government-backed acceleration programme.
KUCHING, June 11 (Bernama) -- Sarawak will roll out four pilot projects this year under the Bintulu Transitioning Industrial Cluster (TIC) initiative to accelerate industrial decarbonisation, strengthen competitiveness and position the state as a leader in low-carbon industrial development in Asia.
KUALA LUMPUR, May 22 (Bernama) -- The Malaysian Investment Development Authority (MIDA) has collaborated with Daikin Malaysia Sdn Bhd and the Selangor Human Resource Development Centre (SHRDC) to organise the MIDA-Daikin Supply Chain Programme.
By Durratul Ain Ahmad Fuad
KUALA LUMPUR, May 12 (Bernama) -- Taiwan is seeking to strengthen cooperation with Malaysia in the high-tech supply chain, particularly in the electrical and electronics (E&E) sector, including semiconductors and artificial intelligence (AI).
KUALA LUMPUR, May 12 (Bernama) -- Taiwan has urged the Malaysian government to initiate negotiations to update the Malaysia-Taiwan Bilateral Investment Agreement (BIA) signed in 1993 to reflect today’s evolving global investment landscape.
KUALA LUMPUR, May 8 (Bernama) -- Digital twin technology and smart manufacturing are becoming increasingly important in strengthening Malaysia’s industrial ecosystem, according to the Malaysian Investment Development Authority (MIDA).
KUALA LUMPUR, May 7 (Bernama) -- The Malaysian Investment Development Authority (MIDA) is strengthening Malaysia’s semiconductor ecosystem through a strategic focus on talent development, smart manufacturing and supply chain integration in conjunction with SEMICON Southeast Asia 2026.
By Abdul Hamid A Rahman
KUALA LUMPUR, May 6 (Bernama) -- Taiwan is looking to strengthen collaboration with Malaysia in the semiconductor and smart manufacturing sectors, particularly in data centres and robotics, by leveraging the complementary strengths of both economies across the semiconductor value chain.
KUALA LUMPUR, April 28 (Bernama) -- The first overseas edition of Guangdong’s “Goods Go Global” trade promotion programme has brought more than 70 manufacturers from Zhongshan to Kuala Lumpur, showcasing consumer goods and smart manufacturing products over the weekend.
KUALA LUMPUR, April 22 (Bernama) -- Malaysia will continue to strengthen its semiconductor ecosystem this year through supply chain integration, local capability development and high-value partnerships, with platforms such as SEMICON Southeast Asia (SEMICON SEA) 2026 expected to play a catalytic role.
KUALA LUMPUR, April 13 (Bernama) -- Taiwan Smart Solutions Connect 2026, organised by the Taiwan International Trade Administration (TITA) and the Taiwan External Trade Development Council (TAITRA) in collaboration with the Federation of Malaysian Manufacturing (FMM), will take place on May 12, 2026.
GEORGE TOWN, April 6 (Bernama) -- Taiwanese electronics giant Advantech Co Ltd has signed three strategic memoranda of understanding (MoU) at the Advantech ASEAN Connect Conference 2026.
