GEORGE TOWN, Dec 3 (Bernama) -- InvestPenang and Intel Corporation will continue working closely together to strengthen Penang as the state transitions into the critical areas of advanced packaging and next-generation technologies.
In a statement, InvestPenang said it has identified several potential areas of strategic collaboration and sought Intel’s continued leadership in the sector.
“This alignment of Malaysia’s national policy with Intel’s roadmap reinforces shared commitment to developing talent, driving R&D innovation, and strengthening supply chain resilience.
“Intel fully supports the state’s vision and has been championing the National Semiconductor Strategy (NSS) as a catalyst to position Malaysia at the forefront of Advanced Packaging and IC Design,” it said.
The statement was released after a meeting between Chief Minister Chow Kon Yeow and Intel’s chief executive officer, Tan Lip-Bu, today.
InvestPenang highlighted that Intel’s 50-year presence in Penang has played a pivotal role in transforming Malaysia into one of the world’s most competitive semiconductor hubs.
“The chief minister also expressed his appreciation to Intel for its long-standing commitment, which has driven growth in Malaysia and Penang, nurtured a strong talent base, developed a resilient supply chain, and established a globally recognised backend engineering ecosystem,” it said.
Meanwhile, Intel also expressed their appreciation to Chow for the unwavering support of the Penang state government and the relevant agencies, adding that its investment in the Advanced Packaging Plant in Penang has achieved a capital expenditure of RM12 billion in infrastructure and is now 99 per cent complete.
--BERNAMA