Weeroc Space Achieves Tapeout Milestone, Strengthens Malaysia’s IC Design Capabilities

KUALA LUMPUR, April 15 (Bernama) -- Weeroc Space Sdn Bhd, the aerospace arm of France-based Weeroc, has successfully achieved a tapeout milestone, marking a critical step in the journey from chip design to manufacturing.

Tapeout represents the stage at which a semiconductor design is finalised and sent for fabrication, signalling readiness for production and commercialisation.

Weeroc co-founder and chief technology officer Dr Salleh Ahmad said the milestone represents a defining achievement for a fabless semiconductor company, marking the completion of a rigorous design and validation process.

“It marks the completion of the chip design phase, when the final blueprint is sent to the foundry for fabrication, an achievement that all fabless semiconductor companies strive for, as it signifies the culmination of extensive design efforts,” he said in a statement today.

Salleh said the manufactured chip will then undergo testing and characterisation before being integrated into the company’s products.

“It is significant given that very few companies are able to tape out their own products. We are among the few companies in Malaysia capable of doing so,” he added.

He said the milestone not only validates the company’s engineering capabilities but also strengthens its commercial positioning, enabling it to engage customers with greater confidence and accelerate the introduction of new products to market.

For Malaysia, such milestones reflect a growing capability not only in manufacturing but also in the design and development of advanced semiconductor technologies.

Weeroc Space, a semiconductor innovator supported by the Malaysia Semiconductor IC Design Park, said such achievements signal the increasing maturity of Malaysia’s semiconductor ecosystem.

As more companies reach advanced development stages, this reflects a strengthening pipeline of innovation, technical expertise and global competitiveness.

-- BERNAMA