KUALA LUMPUR, March 10 (Bernama) -- Silicon Connect Sdn Bhd and United Kingdom (UK)-based Semiwise Ltd have signed a memorandum of understanding (MoU) which will see both companies sharing their expertise in electronics, semiconductors as well as technologies.
Silicon Connect chief executive officer (CEO) Chin Yoong Tatt said the partnership will see the development of a scalable pathway for power electronics modules, offering a comprehensive customer solution that encompasses design modelling, rapid prototyping, process optimisation, and advanced panel-level packaging.
"Advancing 3D interconnect technology is critical for achieving multi-chip heterogeneous integration, particularly for high-performance computing and artificial intelligence (Al) hardware. This includes the development of key processes such as Through-Silicon Vias, hybrid copper bonding, micro-bumping, and wafer-to-wafer bonding, enabling seamless and efficient 3D integration solutions.
"Silicon Connect will engage in the co-creation of ideas for product development and explore joint business opportunities, with plans to set up an office in the UK when opportunity arises," he told Bernama after signing the MoU here, today.
The signing of the MoU was witnessed by the Deputy Minister of Investment Trade and Industry, Liew Chin Tong and UK Minister for Indo-Pacific, Catherine West.
According to the British High Commission in Kuala Lumpur, the partnerships demonstrates the complementarity between the UK's strength in research and development, innovation, intellectual property (IP) and Malaysia's expertise in manufacturing and precision engineering.
Chin said the MoU also includes semiconductor training, including Complementary Metal-Oxide-Semiconductor, and Power Electronics and Virtual Reality Manufacturing Fab, enabled by state-of-the-art Technology Computer-Aided Design tools from Synopsis.
He added that the partnership is a new model of collaboration which will allow both countries to act/collaborate as peers to and complement each other's expertise.
"The UK will be able to provide expertise in IP, innovation and technology, while Malaysia’s strengths in manufacturing and equipment will support scaling up and commercialising these innovations.
"This partnership synergy will further strengthen Malaysia and the UK's appeal in the highly competitive semiconductor global supply chain," he added.
-- BERNAMA
