Lantronix Powers Next-Generation AI-Enabled Camera Solutions With Seamless Teledyne FLIR Thermal Integration

IRVINE, Calif., March 5 (Bernama) -- Lantronix Inc. (NASDAQ: LTRX), a global leader of compute and connectivity for IoT solutions enabling AI Edge Intelligence, today announced a breakthrough in AI-powered camera technology with the seamless integration of its high-performance Open-Q™ System-on-Module (SoM) solutions including hardware and software with Teledyne FLIR’s thermal infrared (IR) camera modules and Prism™ embedded software. This integration accelerates the development of next-generation AI-enabled camera solutions in autonomous navigation/drones, surveillance and robotics.

Powered by Lantronix’s cutting-edge Open-Q SoMs, based on the Qualcomm Dragonwing™ QRB5165 and QCS8250 processor platforms, this solution delivers unparalleled processing capabilities for AI-driven situational awareness, advanced computational imaging and real-time decision-making. Lantronix’s seamless technology integration provides a competitive edge, enabling developers to create high-performance, size-, weight- and power-optimized (SWaP) AI camera solutions that push the boundaries of innovation.